SAVING SPACE FOR SPACE CONCERNS
UTMC Microelectric Systems has added the UTXQ512K32 16M SRAM Multichip Module (MCM) to its Class T memory family. The 16M SRAM MCM packages four 4M memory die using both sides of the substrate in a 68-lead ceramic flatpack. This technique increases packaging density, saving space and weight, and...
Subscription Required
This content requires a subscription to one of the Aviation Week Intelligence Network (AWIN) bundles.
Schedule a demo today to find out how you can access this content and similar content related to your area of the global aviation industry.
Already an AWIN subscriber? Login
Did you know? Aviation Week has won top honors multiple times in the Jesse H. Neal National Business Journalism Awards, the business-to-business media equivalent of the Pulitzer Prizes.
Related Content
