The Challenges And Solutions of Embedded Electronics In Hypersonic Flight
Hypersonic flight introduces fundamental changes to the way today’s missiles operate. Matching and overcoming hypersonic threats will demand technology advances across three broad areas: (1) propulsion systems, (2) airframe materials, and (3) embedded electronics. While most R&D spending is targeting the first two areas, it is clear that innovative improvements in embedded electronics are key to creating fully functional hypersonic systems.
This white paper, written by Lorne Graves, Abaco Systems’ Chief Technology Officer, will examine the nature of embedded electronics challenges and some promising solutions and innovations from a company that brings decades of embedded expertise to the hypersonic systems environment.