Engineers at the Georgia Tech Research Institute (GTRI) and Raytheon are co-developing a new material designed to transfer heat away from high-power electronic equipment such as next-generation radars. Made from a composite of diamond and copper, the material is one of a number of exotic materials in development under GTRI’s “Thermal Ground Plane” initiative that aims to remove heat up to 100 times more effectively than existing thermal-conducting technologies. The goal is to raise thermal ...

THIS CONTENT REQUIRES SUBSCRIPTION ACCESS

You must be a paid subscriber to access "Georgia Tech, Raytheon Developing Advanced Heat-Transfer Materials".

 

Current Aviation Week Intelligence Network (AWIN) enterprise and individual members: please go to http://awin.aviationweek.com for access.

 

Not currently a subscriber? Click on the "Learn More" button below to view subscription offers.

Already registered? here.